Intel is set to release its next-gen Rocket Lake CPU at some point in 2021, but it looks like motherboards that support the new processors are going to come way before the launch of the actual CPU. In a report from Chinese news outlet Weixin, Intel could be looking to release 500 series motherboards featuring the Z590, B560, and H510 chipsets as early as January 11.
The report from Weixin also claims that the Rocket Lake CPU launch will come later on in Q1 2021, likely in late February or early March. So far nothing has been confirmed by Intel, but, if the report is true, the launch of the motherboards would coincide with the virtual CES 2021 event.
Intel prepares for the future
When it comes to features of the new chipsets, consumers will see long-awaited features finally come to fruition if they are to support the Rocket Lake CPUs. The new processors will have PCI-E 4.0 support right out of the box and communication bandwidth increase from four to eight lanes. The new motherboards are also expected to have updated on-board ports such as USB 3.2 Gen 2.2, HDMI 2.0b, and Thunderbolt 4.
As far as the Rocket Lake specs go, leaks have slowly made their way out via various channels, giving everyone a good idea of what they can expect. The new processors will also fit LGA 1200 sockets, a change from the LGA 1155 socket that had become commonplace for Intel CPUs for years until the launch of the Comet Lake CPUs this year.
PC Invasion reached out to Intel regarding the 500 series motherboards release report. A representative from the company responded saying, “We don’t comment on rumor or speculation.”
